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Qualcomm 8797 New! Jun 2026

| Component | Specification | | :--- | :--- | | | Qualcomm 8797 (Engineering Sample) | | Final Name | Snapdragon 8cx Gen 2 (SC8180XP) | | Process | TSMC 7nm (N7P) | | CPU | Kryo 495 (Octa-core) - 4x Cortex-A76-like @ 3.15 GHz - 4x Cortex-A55-like @ 1.8 GHz | | GPU | Adreno 690 (up to 2.1 TFLOPS, DirectX 12) | | Memory | LPDDR4X-2133 (up to 32 GB) | | TDP (Thermal Design Power) | 7 Watts (fanless) – up to 15W burst | | ISP (Image Signal Processor) | Spectra 390 (2x 14-bit, 32MP single / 16MP dual) | | Connectivity | Snapdragon X55 5G Modem (external, 7Gbps down) | | AI Engine | Hexagon 690 (9 TOPS) |

In the fast-paced world of mobile technology, few numbers command as much attention as Qualcomm’s Snapdragon model codes. From the legendary Snapdragon 835 to the powerhouse 8 Gen series, enthusiasts and analysts have learned to spot the next big thing by its numeric designation. Recently, a specific alphanumeric sequence has begun circulating in forums, speculation threads, and even some premature benchmark databases: .

: The system features hardware-level virtualization and mixed-criticality workload management. This allows the chip to dynamically shift computing resources between heavy AI perception pipelines and high-end infotainment without sacrificing real-time safety responsiveness.

But sometimes, when he was debugging a piece of stubborn code on his work laptop, the error message would look a little too elegant. The solution would appear a little too perfectly. And he’d smile.

| Category | Specification | |---|---| | | TSMC 4nm N4 | | CPU Architecture | Qualcomm Oryon (custom architecture) | | CPU Compute Power | Up to 660K DMIPS | | GPU Compute Power | Up to 8.1 TFLOPS (FP32) | | AI Compute Power | Up to 320 TOPS (dense) / 640 TOPS (sparse) | | Memory Support | Up to 64GB LPDDR5X | | Maximum Displays Supported | 8 screens (including 3K/4K high-definition displays) | | Peripheral I/O | Supports up to 40+ cameras and multi-modal sensors | | Package Form | QAM8797P module, 2253-pin FCBGA+HS package | | Application Domains | Intelligent cockpit, ADAS, cabin-driving fusion, VLA large models | qualcomm 8797

The true death knell for the Qualcomm 8797 was . The X24 modem was a technological marvel for 4G, but by Q3 2018, Samsung, Huawei, and Apple were already demanding 5G solutions. Qualcomm pivoted aggressively to the Snapdragon X50 (first-gen 5G modem) and later the integrated X55. Launching a flagship 4G-only chip in 2019 would have been commercial suicide. Thus, any silicon destined for the 8797 name was either:

A single chip system can manage up to 13 cameras concurrently , processing dense data streams originating from Lidar, automotive millimeter-wave radar, ultrasonic suites, and high-precision Inertial Measurement Units (IMUs). This compute density fuels over 30 advanced safety features, including Point-to-Point (P2P) autonomous urban piloting and intricate automated parking scenarios.

The Snapdragon 8797 is a high-performance, centralized computing platform designed to unify previously fragmented vehicle domains. It is part of the ecosystem, designed to bridge the gap between advanced cockpit entertainment, high-level Autonomous Driving Systems (ADAS), and cloud-connected services.

The defining feature of the 8797 is its heterogeneous compute architecture. It doesn’t just rely on one CPU; it utilizes a combo of the Kryo CPU, Adreno GPU, and most importantly, the . | Component | Specification | | :--- |

The SA8797 powers the systems, enabling a seamless blend of driver assistance and passenger entertainment.

The QCA8797 is paired with a Snapdragon 600 or 400 series processor to create factory automation hubs. Its ability to handle extreme temperatures (-30°C to +85°C) makes it superior to consumer Wi-Fi cards.

: Capable of over 560,000 DMIPS , providing the raw processing power needed for complex vehicle architectures.

The Qualcomm 8797 fits squarely into a transitional period. It was developed during a time when Qualcomm was still using its custom Kryo cores before the shift to the ARM Cortex-X "Prime Core" architecture. To find the 8797’s place, we must look at its released siblings: the and the Snapdragon 865 (SM8250) . The solution would appear a little too perfectly

The automotive industry is undergoing a massive shift from traditional mechanical hardware to software-defined vehicles (SDVs). At the heart of this transformation is the (also commercialized under the flagship Snapdragon Ride Elite and Cockpit Elite platforms, including variants like the SA8797P and QAM8797P).

While technical specifications are still emerging, the chip is characterized by the following: Integrated Intelligent Architecture

Built for automotive safety standards, the SoC provides the necessary robustness to handle safety-critical ADAS functions. 3. Transforming the Cabin and Driving Experience